R&D and Design-SONT Technologies Co., Ltd.

Abilities

R&D Team

R & D personnel account for over 28% of the total(Most of R&D engineers with more than 10 years’ experience)
A full-spectrum team with experience in optical, electronic, mechanical, software, testing, and manufacturing procedures

Innovative COB/BOX packaging technologies

COB: Mature COB (chip on board) technology is applied to the QSFP28 optical module to achieve superior optical performance indexes while ensuring high reliability.

Products:100G QSFP28 SR4/100G QSFP28 LR4/100G QSFP28 AOC/25G SFP28 SR/25G SFP28 AOC.etc

Material Clean

LD-Die Bond

LIV Test

Auto Bond

Wire Bond

Alignment

BOX:High Speed Hermetic BOX Packaging for High precision machiningand Stable Gold Wire Bonding for AWG/TFF BOX Packaging

Products:100G QSFP28 LR4/100G QSFP28 ER4/25G SFP28 LR/25G SFP28 CWDM/25G SFP28 DWDM/25G SFP28 Lan WDM .etc

Material Clean

LD-Die Bond

LIV Test

Auto Bond

Alignment

Leading National key R&D plan

Silicon-Based Optoelectronics

As a leading company in Silicon- based optoelectronic chips and subsystems for 25G / 50G / 100G PON applications
High-Speed PAM4 Transceivers

Cooperation with Beijing University ,Key technology research of 50G, 200G&400G PAM4 high speed Transceivers for 5G and large /super large Data-Center